Technical Capability
No. | Type | Item | Parameter |
1 | FPC | Base mateiral | PI |
Layers | 1-6 layers | ||
Board thickness | 0.1-0.6mm | ||
Max. Product size | 9*22inch | ||
Min.bending radius | 3-6 times the board thickness | ||
Min. Line width /space | 3/3mil | ||
Tolerance of outline | ±0.05mm | ||
2 | FPCB | Structure | Multi-layer flexible paging or bonding structure, HDI structure |
Layers | 2-20 layers | ||
Min. flexible zone width | 5mm | ||
Min. Line width /space | inner3/3mil、outer3.5/3.5mil | ||
Min.Hole size | 0.10mm(laser-drilling)/0.15mm(machine drilling) | ||
Min.welding ring width | 4mil | ||
Hole to conductor spacing | <=6layers:5mil,7-11layers:6mil,>=12layer:8mil | ||
Thickness aperture ratio | 1︰1(blind hole);16︰1(through-hole) | ||
Tolerance of outline | ±0.10mm | ||
Surface treatment | ENIG、HASL、FLASH GOLD、HARD GOLD、OSP |