Technical Capability
| No. | Type | Item | Parameter |
| 1 | FPC | Base mateiral | PI |
| Layers | 1-6 layers | ||
| Board thickness | 0.1-0.6mm | ||
| Max. Product size | 9*22inch | ||
| Min.bending radius | 3-6 times the board thickness | ||
| Min. Line width /space | 3/3mil | ||
| Tolerance of outline | ±0.05mm | ||
| 2 | FPCB | Structure | Multi-layer flexible paging or bonding structure, HDI structure |
| Layers | 2-20 layers | ||
| Min. flexible zone width | 5mm | ||
| Min. Line width /space | inner3/3mil、outer3.5/3.5mil | ||
| Min.Hole size | 0.10mm(laser-drilling）/0.15mm(machine drilling） | ||
| Min.welding ring width | 4mil | ||
| Hole to conductor spacing | <=6layers:5mil，7-11layers:6mil，>=12layer:8mil | ||
| Thickness aperture ratio | 1︰1（blind hole）；16︰1（through-hole） | ||
| Tolerance of outline | ±0.10mm | ||
| Surface treatment | ENIG、HASL、FLASH GOLD、HARD GOLD、OSP |
