Technical Capability

No. Type Item Parameter
1 FPC Base mateiral PI 
Layers 1-6 layers 
Board thickness  0.1-0.6mm
 Max. Product size  9*22inch
Min.bending radius 3-6 times the board thickness
 Min. Line width /space 3/3mil
Tolerance of outline ±0.05mm 
2 FPCB Structure Multi-layer flexible paging or bonding structure, HDI structure
Layers  2-20 layers 
Min. flexible zone width 5mm
Min. Line width /space  inner3/3mil、outer3.5/3.5mil
Min.Hole size  0.10mm(laser-drilling)/0.15mm(machine drilling)
Min.welding ring width 4mil
Hole to conductor spacing <=6layers:5mil,7-11layers:6mil,>=12layer:8mil
Thickness aperture ratio 1︰1(blind hole);16︰1(through-hole) 
Tolerance of outline  ±0.10mm
  Surface treatment  ENIG、HASL、FLASH GOLD、HARD GOLD、OSP